default image
Non-destructive removal and replacement system for circuit board chips
Non-destructive chip replacement system: recycling waste boards and repairing faults.
Type
Equipment
Tags
Mechanical manufacturing automation
Electronic waste/by-product recycling
Non-destructive removal
Circuit board chip
Solution maturity
Mass promotion / Mass production
Cooperation methods
Face-to-face consultation
Applicable industry
Residential services, repairs and other services
Applications
Electronic remanufacturing
Key innovations
The innovation of this system lies in: realizing non-destructive disassembly and precise replacement of chips, integrating visual recognition, precision temperature control and multi-axis automation technologies, significantly improving the resource utilization and maintenance efficiency of waste boards, and having a high degree of technical integration.
Potential economic benefits
Promote the resource reuse of waste circuit boards, reduce maintenance costs, extend product life, improve economic benefits, and help the development of circular economy.
Potential climate benefits
The system directly reduces the production demand for new components by recycling waste circuit board components through non-destructive disassembly, thereby reducing energy consumption and carbon emissions during the manufacturing process.
Solution supplier
View more
Shanghai second Polytechnic University
Shanghai second Polytechnic University
Shanghai Second Polytechnic University focuses on industrial applications, cultivates senior specialized talents with strong practical abilities, and helps industrial upgrading.
Shanghai,China
Solution details

 "Circuit Board Chip Non-destructive Removal and Replacement System" is an automated professional equipment with soldering and disassembly functions of circuit board chips. It is used for the non-destructive removal of components from waste circuit boards and the resource reuse of waste circuit boards; and circuit board maintenance, such as the removal and replacement of damaged components on the circuit board. The equipment consists of major components such as a 5-axis motion platform, circuit board heating device, industrial camera, temperature sensor, limit sensor, high-pressure air pump subsystem, and computer control subsystem. The industrial camera and electronic component image recognition software form an electronic component recognition and detection subsystem to locate the number of components to be disassembled and the coordinate parameters on the platform; the heating device and temperature control subsystem realize temperature control during the heating process and time control during the disassembly process; the high-pressure air pump subsystem provides power for component grabbing; the 5-axis motion platform realizes three-coordinate movement of the grasping robot, grabbing or placing components, and industrial camera movement.


Last updated
12:14:17, Nov 04, 2025
Information contributed by

See original page on

Report