After years of R & D and trial production, our entrepreneurial team has broken through many key cooling technology and optical design bottlenecks, adopted the world's most cutting-edge packaging technology and process, and successfully developed a new generation of LED car headlight systems that no domestic company can industrially produce (and no international production). The key technologies and innovations adopted in this project are:1) Select a new superconducting wafer in light source design, and use a new independently developed ceramic phosphor during chip packaging, which can increase the LED luminous efficiency from 80lm/W to 170lm/W (At present, the maximum in China can only achieve about 120lm/W);2) Using the third-generation high heat dissipation coefficient ceramic substrate technology, the M-COB multi-chip modular light source package design is carried out. Compared with the current commonly used aluminum substrate SMD chip packaging technology: it greatly improves the heat dissipation and optical effects, and significantly reduces the packaging cost;3) Using constant current power supply technology, an intelligent temperature control driving circuit with protection function is designed: it can ensure that the lamp system can achieve high brightness, small size, high heat dissipation, low energy consumption, strong stability and long life, solving the problem of LED lighting system heating that affects light decay and service life; 4) Integrated optimization and improvement of the system efficiency and production process of optical elements have been carried out to optimize the entire lighting system in terms of light efficiency, price, volume, service life, etc., and its cost and selling price are on average lower than those of foreign companies. 30%, with extremely high cost performance, the product has now been successfully sold to the three major American automobile companies, laying a solid foundation for the implementation of the industrial production of this project.