Introduction to the results:

This project belongs to the integrated technology field of light, machinery, electricity and materials, and has the characteristics of multi-disciplinary integration. Semiconductor lasers have the advantages of high efficiency, small size, light weight, simple structure, ability to directly convert electrical energy into laser energy, high power conversion efficiency, easy direct modulation, and power saving, so their application fields are expanding day by day. Semiconductor laser technology has become an emerging technology with great appeal and has been widely used in industry. High-power semiconductor pumped lasers are one of the most promising fields in semiconductor laser technology.

The biggest shortcoming of semiconductor lasers is that the laser performance is greatly affected by temperature and the divergence angle of the beam is large. Packaging costs account for half of the cost of semiconductor laser components. Packaging technology not only directly affects the reliability of pump laser components, but also directly affects whether the performance of pump laser chips can be fully exerted. This project studies the packaging technology of uncooled high-power 980nm pump lasers. The entire packaging technology involves optics, electronics, thermology, mechanics, etc., and the accuracy reaches the order of microns. By adopting flip-chip chip technology for laser chips, miniaturization and all-metallized glue-free packaging technology, the fiber amplifier's requirements for small size, high power, low cost and high reliability of pump lasers are finally met. Optical coupling uses lens fiber direct coupling to minimize the number of components and related losses in the coupling system and improve the reliability and ease of operation of the optical path. Double fiber grating wavelength locking technology is used to improve the side-mode suppression ratio and wavelength stability of uncooled high-power 980nm pump lasers. By adopting these technologies, the project team finally solved a series of key technologies for packaging uncooled high-power 980nm pump lasers. The research results on key technologies for uncooled high-power 980nm pump laser packaging have been successfully applied to the mass production of related products, creating good economic benefits for the company. In terms of social benefits, it fills the shortcomings of my country's uncooled high-power semiconductor pumped lasers, and plays a positive role in promoting the technological progress of the industry and the optimization and upgrading of industrial structure.

Key technologies:

After testing by the National Optical Instrument Quality Supervision and Inspection Center, the main technical indicators of uncooled high-power 980nm pump laser are as follows:

    1. Shell size: 12.7(mm)×7.4(mm)×5.2 (mm)

    2. Working temperature: 0-70℃

    3. Center wavelength: 980nm

    4. Spectral width: 1nm

    5. Threshold current: 24mA

    6. Output power: 240mW

    7. Power consumption: less than 1W

Application situation and prospects:

The research results of this project, through industry-university-research cooperation with relevant companies, and after nearly five years of technical research and development and continuous improvement, the research results of key technologies for uncooled high-power 980nm pump laser packaging have been successfully applied to the mass production of related products, creating good economic benefits for the company. In terms of social benefits, it fills the shortcomings of my country's uncooled high-power semiconductor pumped lasers, and plays a positive role in promoting the technological progress of the industry and the optimization and upgrading of industrial structure.

Coupled packaging is a series of processes that require very high precision, which makes it difficult to implement automated technology. Therefore, the research results of miniaturized pump laser packaging technology are particularly suitable for an environment like China with low labor costs and a good technical foundation. Through research on the packaging technology of miniaturized 980nm pump lasers, the source innovation of packaging technology has been achieved, which helps to expand into the coupled packaging of other semiconductor pump lasers and optoelectronic devices. This technology has broad market potential and broad promotion and application prospects in the application of optoelectronic devices, and will become an important technical support for the formation of optoelectronic device packaging technology industry.