The project is in the field of microelectromechanical systems (MEMS). MEMS can integrate sensors, actuators and processing circuits together to form a monolithic integrated sensor or system, and can also realize large-scale batch manufacturing. It is the core chip technology supporting the development of intelligent technology. In view of the weak MEMS scale manufacturing capability in China, the project, supported by the National 973 Project and other projects, invented the key technology of micro-nano scale manufacturing that only needs single-sided processing based on the self-limiting characteristics of the process, realizing the breakthrough of zero MEMS scale manufacturing in China, and the results have been applied on a large scale, breaking the monopoly situation of overseas products. 1. Invented a micro-mechanical structure manufacturing technology that only requires single-sided processing of silicon wafers, and has become the mainstream technology in international MEMS chip manufacturing. Micromechanical structures are the core of MEMS devices. This invention aims at the problems of poor compatibility with IC processes and unsuitability for large-scale manufacturing caused by the need for double-sided processing in the past. Focusing on the most commonly used monocrystalline silicon and dielectric materials, the manufacturing needs of micromechanical structures, based on the self-limiting characteristics of the process, a micromechanical structure manufacturing technology that only requires single-sided processing of silicon wafers has been invented. It is compatible with the IC process and can make full use of integrated circuit production lines to establish a MEMS large-scale manufacturing platform and realize large-scale production of MEMS sensors. 2. Invented the manufacturing technology of nano-sensitive structures based on MEMS, and the detection limit of the DNA sensor developed is at the best international level. Nano-sensitive structures are the core of the development of new-principle MEMS devices using scale effect sensitivity mechanisms. In the past, nano-sensitive structures were mainly fabricated by electron beam lithography or focused ion beam, which was costly and inefficient, making it difficult to achieve large-scale manufacturing. Aiming at this problem, the invention focuses on the scale manufacturing needs of the most commonly used typical nano-sensitive structures such as nanowires, beams and needle tips, cleverly utilizes self-alignment and self-stopping process methods, and adopts conventional MEMS processes to invent MEMS-based Nano-sensitive structure manufacturing technology can achieve large-scale manufacturing of nano-sensitive structures. 3. Invented low-temperature and low-stress packaging technology, reduced packaging costs and formed an international standard. Since most MEMS sensors have movable or sensitive areas, direct scribing can easily damage these areas, and how to protect non-sensitive areas is also a problem. Aiming at the problem of MEMS scale packaging, this invention invented low-temperature and low-stress packaging technology around silicon cover plate and organic cover plate wafer-level packaging with a wide range of applications, and proposed and formed the only IEC international standard in my country's MEMS field. The results have established a platform and achieved a breakthrough and large-scale application of zero-scale MEMS manufacturing in my country. Shanghua and SMIC have established MEMS large-scale manufacturing technology platforms in Wuxi, with annual chip shipments increasing from less than a thousand to more than 40,000, providing OEM services for more than 90% of domestic MEMS sensor chips. The cumulative production and sales of MEMS sensors exceed 80 million, and annual shipments exceed 20 million. The completed unit has become the largest supplier of domestic MEMS automotive pressure and blood pressure sensors. In 2017, it was selected as one of the top ten semiconductor MEMS companies in China. In the past three years, the sales of MEMS chip foundries and MEMS sensors per unit have exceeded more than 270 million yuan, of which the sales (or output value) brought by only two users using the products provided by the completed unit have exceeded 300 million yuan. The results have been highly praised by a series of citations from international colleagues: 63 invention patents have been authorized, 1 IEC international standard for MEMS in my country, 70 papers have been published, SCI has included 53 articles, EI has included 15 articles, Google has cited 1265 times, SCI has cited 747 times, he cited a single article of Google has cited a maximum of 175 times, and SCI has cited a single article of SCI has cited a maximum of 107 times. It has been highly praised by international colleagues, has had an important impact internationally, and has reached the international advanced level as a whole.