This project belongs to the field of semiconductor lighting. LEDs have the advantages of energy conservation and environmental protection, and are known as the green lighting source of the 21st century. However, the promotion and application of LED products in the field of lighting still needs to solve key issues such as luminous efficiency and light output uniformity by increasing light density under the limited size of the lamp. Chip-level packaged LEDs (referred to as CSP-LEDs) break through the limitations of traditional devices on package size. The size of the light source package is no more than 120% compared to the chip size. Due to its small size, the material cost of each device can be reduced and a broad space is provided for secondary optical design. At the same time, this model has the characteristics of high optical density, no gold wire, no bracket, no die fixing glue, and low thermal resistance, making CSP-LED have the advantages of high efficiency, reliability, low cost and designability. This project adopts a brand-new technology and technology to break through the size limitations of traditional LED packaging. The core performance indicators of the product are superior to similar products of international leading LED light sources and lighting companies, reaching the international advanced level. Due to its small size, high reliability and adjustable light color, the CSP-LEDs of this project are very suitable for high-quality lighting. Its emergence will become a major breakthrough in lighting technology and has innovative historical significance in the history of the development of semiconductor light sources. Supported by the National Innovation Fund and the Shanghai City Industrial Transformation, Upgrading and Development Special Project, this project has broken through the R & D barriers of white LEDs to achieve efficient, highly reliable, and tunable white light emission under the requirements of chip-level package size. Starting from the basic scientific issues of phosphor crystal field control and basic technical issues such as glue film forming process, CSP packaging process and tunable color design, Invented three series of core technologies: fluorescent conversion material preparation, packaging process, and light color control involved in the CSP-LED light source industrialization chain: (1) Invented low-temperature microstructure control technology to realize low-temperature reduction and crystal field control of phosphors to prepare full-color high-efficiency phosphors; The first solvent-free sedimentation and locking technology is used to lock in the dispersion and sedimentation of fluorescent powder to the greatest extent, and to prepare CSP fluorescent film materials with high efficiency, controllable thickness, and uniform light emission, overcoming the shortcomings of dispensing technology. (2) The first vacuum lamination integrated technology for high-efficiency and reliable LED light sources in chip-level packaging, and developed a CSP-LED light source with uniform light emission on five sides, which broke through the limitation of traditional LED light sources on one side. The light efficiency is greater than 160lm/W. The color rendering index reaches 95, and the product performance reaches the international advanced level. (3) Invented intelligent adjustable light color technology, which realizes light color control through the multi-color adjustable CSP module arrangement array and precise control of driving power supply. The core performance indicators of the produced LED lamps have reached the international advanced level. This project has applied for more than 60 intellectual property rights, including 3 international PCT patents and 8 authorized invention patents; and published more than 50 papers. At present, the key technologies of this project have been transformed and applied in Shanghai Yaming Lighting Co., Ltd. and Shanghai Boenstone Co., Ltd. The fluorescent glue films produced have been adopted by well-known domestic and foreign LED light source manufacturers OSRAM (Germany), Broadcom (United States), Sanan Optoelectronics (the mainland of China). The LED lamps manufactured based on this project technology have passed U.S. UL and EU CE certifications, and have been exported to more than 100 countries and regions such as Europe and the United States. In the past three years, the LED lamps have been added by 5 billion yuan. They have been used in Shanghai Center Building, National Convention and Exhibition Center (Shanghai), Shanghai Disney Center Landscape Road, Beijing Olympic Plaza Central Lamp Posts and other national key landmark projects. With the promotion of the CSP-LED technology developed by this project, it will further promote the process of realizing comprehensive green energy-saving lighting in my country, with significant social and economic benefits.