Chip processing equipment is an important factor that affects and dominates the competitiveness of the country's information industry. Its key technologies have long been in the hands of Western developed countries and policies of restrictions and embargoes have been imposed on China in terms of advanced equipment. The weakness of my country's high-end chip processing equipment manufacturing has always been a bottleneck restricting the development of my country's electronic information industry. This project develops a dielectric etching machine, which accounts for as much as 60% of the etching machine market and is the core application of etching machine products.
This project is a 28-15 nanometer dielectric etching machine (Primo AD-RIE) successfully developed by China Micro based on the research of its previous product 45-28 nanometer dielectric etching machine. On this basis, it launched two more practical 28-15 nanometer dielectric etching machines: Primo SSC AD-RIE (single reaction table cavity dielectric etching machine) and Primo iDEA ("dual reaction table etching and gel removal machine").
Compared with international monopoly products, there are a series of world-advanced outstanding innovation points, which are summarized as follows:

1. It solves the technical problem of the stability of RF pulsed plasma power transmission, and is the first in the world to achieve reliable operation of dual-frequency synchronous plasma systems on large production lines.
2. The development of dynamic temperature-controlled electrostatic chucks has achieved step-by-step rapid temperature control in multi-layer structure processes and multi-zone wafer temperature fine-tuning functions, thus meeting the process requirements below 28 nm.
3. The iDEA system integrates dielectric etching and de-gluing processes on the same host, thereby achieving damage-free processing of devices and reducing operating costs by more than 30%.
4. The de-gelling reaction chamber is structurally designed to effectively filter out charged particles to achieve high de-gelling rate and no device damage.
   2012-2014 During the year 2000, sales of the above three products reached 331.84 million yuan, of which exports reached 308.48 million yuan. Medium and micro etching machines are quite close to the product development of the current dominant manufacturers in the international market. The project has obtained core independent intellectual property rights, met the 28-15nm integrated circuit process requirements, and its performance indicators have reached the international advanced level of similar products. It has passed the assessment and user certification of large integrated circuit production lines, and has industrialization capabilities and market competitiveness.
   Therefore, CMI's 12-inch high-end plasma etching equipment can compete head-on with the most major foreign equipment manufacturers in a relatively favorable position, and has advantages in product performance, quality and price. The implementation of this project has successfully filled the gap in the domestic cutting-edge semiconductor equipment industry, promoted the development of China's semiconductor production, high-tech equipment industry and related industries, and got rid of the unfavorable situation of being controlled by the United States, Japan, etc.