This project belongs to the field of information technology and is a multidisciplinary intersection of radio frequency and microwave, integrated circuits and computer-aided design. Radio frequency circuit electronic design automation (EDA) is an essential requirement for accurate and efficient research and development of radio frequency circuit system products. It is widely used in wireless communications, Internet of Things, automotive electronics, aerospace and defense electronics. Because the radio frequency circuit system has the characteristics of high cross-scale structural complexity, close coupling of electromagnetic-thermal-stress multiple physical fields, diverse functions/structures, sensitive high-frequency performance to parameters, and cross-level integrated integration of chips/packages/systems, it is accurate Simulation, accurate modeling, collaborative design and automatic optimization are difficult, consume a lot of resources, and have a high technical threshold. my country's RF EDA software market has long been monopolized by foreign companies, which seriously restricts the development of my country's RF electronic technology. Focusing on major national strategic needs, this project carries out systematic and in-depth research on the core scientific and technical issues of RF circuit EDA, and solves a series of key technical issues such as cross-scale multi-physical simulation modeling of RF circuits, circuit automation design, multi-performance/multi-function collaborative design, and advanced RF system development, and successfully developed the first set of domestic RF EDA commercial software and promoted its application. This project has achieved scientific and technological innovation results in three aspects: 1. In terms of RF circuit simulation and modeling, an accurate and efficient electromagnetic field and electromagnetic-thermal-stress coupled multi-physical field simulation algorithm based on the generalized transfer matrix has been proposed, and the first domestic RF circuit chip has been developed. -3D packaging combined with electromagnetic field simulation and modeling commercial software, which is more efficient than similar foreign products by 1%~2 orders of magnitude; independently developed multi-physics simulation software, breaking through the bottleneck of accurate and efficient multi-physics simulation technology for RF packaging structures; more than 500 high-precision models have been built for advanced RF integrated packaging processes. 2. In terms of RF circuit design optimization, methods and tools for automated passive circuit design and lossy filter synthesis have been developed. The layout optimization time is shortened by 70% compared with existing tools, and the equivalent Q value of miniaturized filters is increased by more than 5 times, reaching the level of metal resonant cavities; a multi-performance collaborative design and multi-functional fusion design method for RF circuits is proposed, and the efficiency of electrothermal collaborative optimization is increased by 20~50 times, the optimized maximum operating temperature rise is reduced by 30%, and the functions of up to 6 traditional components are integrated into a single component, significantly reducing the system size. 3. In terms of promotion and application of key technologies, based on the radio frequency EDA methods and tools independently developed by this project, an integrated passive device IP library has been established and 350 million pieces have been authorized for mass production; Various products such as three-dimensional integrated millimeter wave transceiver modules, phased array receiving multi-function system-in-package, and high-power-density front-end components have been developed, realizing integrated and precise design of chips and packages, and solving thermal-stress collaborative optimization and reliability problems., the development cycle has been shortened by half, and the cost has been reduced by 30%. Performance, power consumption and cost have been optimized, and they have been used in large quantities in a new national defense radar product. The results of this project have registered 36 software copyrights, authorized 8 invention patents and 3 utility models, applied for 10 invention patents, published 2 monographs, 1 monograph chapter, and published 46 papers (including 31 papers from internationally renowned IEEE publications in this field); In the past three years, the new output value was 865 million yuan, the profit was 96.51 million yuan, and the tax revenue was 3.28 million yuan. Suzhou Xinhe Electronic Technology Co., Ltd., the project completion unit, has grown into the only domestic RF EDA software supplier, achieving independent control in this field and being applied in Huawei, ZTE, Spreadtrum, SMIC, CLP Group and other units, and exporting to American companies. A group of outstanding talents have been cultivated (including 1 academician of the Chinese Academy of Sciences and 2 national outstanding talents), forming a talent highland; and a path of industry-university-research innovation through the localization of RF EDA has been embarked on.