This achievement belongs to the intersection technical field of electronic information and microelectronic technology. In response to the actual needs of millimeter wave imaging and detection systems in the current dual-use field in terms of imaging and detection systems, miniaturization, batch testing and screening, the following innovative results have been achieved:

1. First, in terms of imaging and detection systems, electronic array scanning technology is used to achieve rapid response to the target, scanning area coverage, and adaptive target acquisition;① A millimeter wave array holographic imaging system and imaging method are invented, which uses multi-level electronic switches to scan the horizontal dimension, scan the longitudinal dimension through mechanical linear motion, and at the same time, scan the depth dimension through multi-frequency point scanning, which can quickly obtain three-dimensional images of the near-field area.② Invented a millimeter-wave three-dimensional active phased array antenna system based on full-chip integration. Its phase shift and attenuation use a self-developed vector modulator chip, and adopts a tile-type plug-in structure to achieve-40 degrees to +40 degrees. Phase shift, high integration and reliability.
2. Secondly, in terms of miniaturization, it combines advanced micro-nano manufacturing thin film technology and millimeter wave monolithic integrated circuit technology to achieve high-density, integrated, and three-dimensional system-level integration of the core circuit;① Invented a method for millimeter wave detector systems, InP-based PIN switching diodes based on plane air bridge structure and integrated switching structure and process technology can effectively simplify device and circuit preparation processes, reduce costs, and improve frequency characteristics.② A millimeter-wave multi-chip embedded three-dimensional system-level integration technology based on a photosensitive BCB composite multilayer thin film process was invented. This technology is based on a photosensitive BCB composite multilayer MEMS process on an ordinary silicon-based substrate that can be used for large-scale production., the active chip is buried, and the integration of off-chip matching circuits and passive filter circuits is completed through a multilayer thin film process. The invention can be compatible with the silicon-based very large scale integrated circuit process. Meet the needs of millimeter-band multi-chip miniaturization and integrated three-dimensional system-level integration.③ Invented a miniature millimeter wave detector with a three-dimensional structure. The system is based on MMIC chips, transceiver antennas, radio frequency circuits and other multi-functional components, which greatly improves the integration level and anti-interference characteristics.④ invented a transceiver module and integration method for millimeter wave array holographic imaging system. The transceiver module adopts a dual local oscillator source structure to reduce the locking time of the phase-locked loop and improve the scanning speed through dual source switching. At the same time, the module will use multi-level switches to form a transceiver array, and at the same time, the transceiver antenna adopts a new small gradually varying slot antenna, which can be highly integrated with the final switch while ensuring system gain and beam angle requirements.
3. Finally, the concept of non-contact measurement and automation is introduced in the batch testing and screening of sub-array element detectors and circuits to achieve low cost, batch, and low test uncertainty.① Invented an automated non-contact millimeter wave transmission characteristics testing method, which completes the calibration of the transmission characteristics of the piece to be tested through non-contact. The system includes a transceiver test bracket, a signal control and processing unit, a transmitting and receiving unit, and a non-contact transmission characteristics calibration algorithm. The invention can meet the production needs of large-scale, batch and low-cost production lines.
   Some of the results of this project have been used in actual system applications and field large-scale tests in user units. The bottleneck of system development and application caused by the embargo on high-end millimeter-wave chips has been solved; the automated test system has served first-class universities in China, solving its bottleneck problem in technological innovation. Short-range detectors have been integrated as a core component in their millimeter wave imaging and detection systems and are used in dual-use fields such as airport security inspections. However, there are currently no similar products in China, which have broad application prospects and significant economic and social benefits. He applied for 17 invention patents on key technologies, published 55 SCI/EI papers, published 1 monograph, and won 3 national, provincial and ministerial awards.